It's hip to be square. TSMC is developing an innovative method for advanced chip packaging to meet the increasing demand for AI-driven computing power. TSMC is collaborating with equipment and ...

The new generation of rectangular silicon wafers represents a significant technological direction for the industry, offering increased module power, optimized container utilization, and reduced system ...

The new generation of rectangular silicon wafers defines an important technological direction for the industry, offering increased module power, optimized container utilization and reduced system ...