Graphics Cards This Zotac mini PC has an inventive way of ditching its RTX 5060 Ti's power cables, and no it's not the same as the Asus BTF way Processors AMD wants to hire people with experience of ...

Can’t boot Windows using a USB drive? If yes, you have come to the correct page. In this post, we will help you find a working fix for boot issues with USB. To boot Windows using USB, you first need ...

Advanced packaging often relies on silicon interposers to connect chiplets and other components inside a package. The problem is that interposers typically exceed the reticle limit, which adds both ...

Electrical interposers provide a convenient surface for mounting multiple chips within a single package, but even though interposer lines theoretically can be routed anywhere, insertion losses limit ...

Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz. At the IEEE ECTC 2025 conference, imec ...

The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a single carrier, achieving a record-low insertion loss of just 0.73dB/mm at frequencies up to 325GHz. This ...

SAN FRANCISCO, March 31 (Reuters) - Lightmatter, a startup valued at $4.4 billion, on Monday released two pieces of technology aimed at speeding up the connections between artificial intelligence ...

A device aiding in the connection to the USB pins on the back of the AI Pin, for purposes of ADB access. Solder a wire to each of your 4 pins. I recommend trying to only have the solder and the wire ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

TL;DR: NVIDIA envisions the future of AI compute with innovations like silicon photonics interposers, 3D stacked DRAM, and GPU tiers. The approach includes module-level cooling, die-to-die electrical ...

Chris has reported for various tech and consumer goods outlets over the past decade, including Android Police and MakeUseOf since early 2022. Previously, he has contributed to outlets such as ...