Scientists in China have created a flexible, thread-like 'fiber chip' that can be woven into fabric, opening the door to ...

The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power ...

Everything that's ever been made or used on a computer comes from transistors and circuits. Join Hank Green for a fascinating ...

Heat-sink devices and technology have many aspects, but I am hooked on basic models of varying sizes and fabrication ...

One analyst is doubling-down on his prediction that Intel might become a secondary manufacturer for Apple Silicon, but not ...

The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in ...

Neurophos is taking a crack at solving the AI industry's power efficiency problem with an optical chip that uses a composite material to do the math required in AI inferencing tasks.

How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.

The technology has significant implications for healthcare. In the BCI field, current systems use stiff electrodes that must ...

A nanostructure made of silver and an atomically thin semiconductor layer can be turned into an ultrafast switching mirror ...

Researchers in Germany have unveiled an ultra-fast light switch that operates 10,000 times quicker than today's computing ...