SEALSQ Corp (NASDAQ: LAES), ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, today announced ...

Apple has bought IC Mask Design, a firm specializing in the layout of chips and processors. Apple is continuously acquiring companies, and most recently appears to have been buying ones concerned with ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

MediaTek has successfully completed the design for a new flagship chip, made on TSMC’s cutting-edge 2nm process. This major milestone promises significant performance and power efficiency gains, with ...

Goal to bring 40% of Taiwan's chip supply to the U.S.; 25% tariff on AI chip imports to U.S.; SK hynix buildout; 2 ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

Abstract: This article introduces an adhesive interposer-based reconfigurable multi-sensor patch interface with on-chip quantized time-domain feature extraction, tailored for heterogeneous ...

A deep dive into the challenges of AI power delivery and how startup Empower Semiconductor attempts to tackle them with its Crescendo family of voltage-regulator ICs. The power demands of data centers ...