Abstract: Against the backdrop of slowing Moore's Law, silicon bridge interconnect technology, as a key solution for heterogeneous integrated packaging, is leading the technological innovation of ...

Abstract: Embedded Multi-die Interconnect Bridge (EMIB) packaging technology has been being widely adopted in Intel's FPGA, Server CPU, GPU, and data centric high-performance compute (HPC) segments ...

L’impronta di packaging statunitense di Intel è un altro elemento distintivo. L’azienda gestisce strutture di packaging avanzate in Messico e Malesia e ha stabilito processi presso la struttura Amkor ...

Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...

Intel said that it's working with a Japanese DRAM company, Saimemory, to use available DRAM effectively by stacking it vertically.

That is the sort of detail that makes rumours sound “real” while still being completely free of consequences. There has been noise that Job’s Mob signed an NDA with Intel and pulled PDK samples for ...

Intel’s 18A is now shipping with gate-all-around and backside power delivery, marking a transition to commercial execution.

Apple is exploring Intel for entry-level M-series chips, reflecting political pressure, cost concerns, and risk diversification rather than dissatisfaction with TSMC. For TSMC, these "non-core" ...

Intel is back in focus as Apple reportedly looks to use its U.S. foundries, sparking fresh debate over whether INTC stock is worth buying now.

NVIDIA is reportedly exploring options to diversify its chip supply chain, and Intel Foundry is an optimistic choice for next-gen AI lineups at the moment. NVIDIA Is Looking at a "Low Risk" ...

Stock futures edged up Wednesday ahead of a widely anticipated Fed rate hold, with Big Tech reports set to drive post-market action. Stride's Career Learning segment delivered strong growth, with ...