Stacking dies will dramatically improve performance, but it’s still a work in progress.

Lauren (Hansen) Holznienkemper is a lead editor for the small business vertical at Forbes Advisor, specializing in HR, payroll and recruiting solutions for small businesses. Using research and writing ...

Traditional EDA tools rely on heuristics and static algorithms, which struggle to scale with modern design complexity. AI introduces a data-driven, adaptive approach, capable of learning from vast ...

FuriosaAI founder and CEO June Paik said his startup’s architecture can reshape an industry dominated by Nvidia (NASDAQ: NVDA ...

SNPS expands its TSMC partnership, advancing AI, SoC, and multi-die design with certified flows, IP, and 3DIC innovations.

Explore Donald Trump’s Oval Office revamp that adds 24-karat gold accents, ornate décor, and bold design changes. Compare the ...

What makes Efficient Computer’s Electron E1 stand out is the programmable nature of the system’s dataflow. The chip has a ...

Abstract: Application-specific instruction-set processors (ASIPs) can yield significantly better performance and energy efficiency results compared to general-purpose processors, while maintaining ...

Synopsys and TSMC have partnered to accelerate the development of next-generation AI chips and multi-die designs.

Cisco software includes a compiler that enables quantum workloads to run in distributed environments, including multivendor ...

Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) shares were trending on Thursday as the company showcased its new A14, ...

Synopsys announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products.