Phone 17 Pro and Pro Max is expected to be powered by Apple’s new A19 Pro chipset, built using TSMC’s advanced 3nm process.

TSMC Arizona broke ground on its third factory in Arizona on Tuesday while getting a visit from a top Trump administration official.

The world’s most advanced chipmaker announced the third phase of its US expansion the same day Commerce Secretary Howard ...

The Snapdragon 8 Elite 2, slated for the Galaxy Z Fold 8 and Z Flip 8 in H2 2026, won’t power the Galaxy S26 series, which ...

The Taiwan Semiconductor Manufacturing Company (TSMC) took another major step in expanding its north Phoenix campus on Tuesday. The company broke ground on its third semiconductor manufacturing fab, ...

TAIPEI] Taiwan Semiconductor Manufacturing Company (TSMC) has begun construction on a third chip plant in Arizona, ramping up ...

Investing.com-- Taiwan Semiconductor Manufacturing (NYSE: TSM) (TSMC) said on Tuesday it had broken ground on a third chip ...

TSMC reportedly still won't use new High-NA EUV lithography machines for its next-gen A14 (1.4nm) process node, will rely on ...

TSMC, the main chipmaker to Apple and Nvidia, is the centrepiece of the US government’s effort to entice manufacturing back home.

The first of these is called 18A-P, and promises another 8 percent performance per watt improvement over the base 18A node.

Intel said on Tuesday that several of its contract manufacturing customers planned to build test chips for a forthcoming ...

The three primary global EDA companies announced the availability of production-ready AI-driven design flows for the Intel ...