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TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips
TSMC is taking the wafer-scale fabrication battle ... it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs.
Design And Reuse1d
GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm ...
Semiconductor Engineering1y
Building CFETs With Monolithic And Sequential 3D
Monolithic 3D integration ... Fig. 1: TSMC used monolithic integration to stack NFET and PFET devices. [1] Depositing the nanosheet stack is straightforward. Etching it with the precision required is ...
Design-Reuse10y
Cadence Receives Three TSMC Partner of the Year Awards for Design IP, 16nm FinFET and 3D-IC Solutions
SAN JOSE, Calif. -- October 1, 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today received three TSMC Partner of the Year Awards during TSMC’s ...