Abstract: A novel chip stacking method with low thermal resistance for 3D integration of a large number of memory chips and processor chips is proposed, namely Massive Orthogonal Stacking Assembly of ...

Abstract: Modern cyber–physical systems (CPSs) and IoT-enabled smart factories rely on human–robot collaboration (HRC) to combine human intuition and robotic precision in real time. Balancing such HRC ...

CAMBRIDGE, MA—Engineers at the Massachusetts Institute of Technology (MIT) have developed an AI-driven robotic assembly system lets users design and build simple, multicomponent objects by describing ...

Plastic production is predicted to keep skyrocketing in the next ten years, and our planet is going to pay the price. But, with all that plastic being made, is it possible we could do some good with ...