Electronic Specifier

DesignSpark PCB version 13 simplifies circuit board design

RS, a global product and service solutions provider for industrial customers, have launched the DesignSpark PCB version 13.
EDN

Automating FOWLP design: A comprehensive framework for next-generation integration

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...
EDN

IGBT7 modules cut power losses up to 20%

Microchip’s DualPack 3 IGBT7 power modules come in six variants at 1200 V and 1700 V with current ratings from 300 A to 900 A ...
IEEE

Design of an Ultra-Wideband High-Efficiency Power Amplifier Based on a Novel Impedance Matching Structure With Three Paths

Abstract: In this brief, a design method for a high-efficiency power amplifier (PA) with a three-octave operation bandwidth is proposed. A unique impedance matching structure with three paths (TPs) ...
IEEE

An Integrated Low-Power Enhanced Pull-Up GaN Driver Using SenseHEMT for Reliable and Fast Short-Circuit Protection

Abstract: This article proposed an integrated GaN driver with a low-power enhanced pull-up (LPEP) technique to achieve the decoupling between the charging path and the leakage path of the inverter in ...