Abstract: The 3-D inductor based on through silicon via (TSV) has been studied in the recent years due to its high density of integration and small footprint area. However, the TSV-based inductor ...
Abstract: As an important technology in the post-Moore era, Chiplet has been widely used in system design. In this work, the thermal cycling reliability of 2.5D Chiplet based on silicon (Si) ...
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