Semiconductor Engineering

Every Atom Now Counts In Advanced Chip Manufacturing

How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.
IEEE

Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
BIC Magazine

Mustang Sampling adds CertiThruProbe Extractor to pipeline probe line

Engineered with a cylindrical crossflow filter to reduce differential pressure and a hollow Teflon® filter to block liquids and particulates, the CertiThruProbe ensures only clean, dry gas reaches the ...
Android

Samsung gets US approval to ship chip equipment to China despite trade restrictions

Samsung has reportedly secured US approval to export American-made chip equipment to its China facilities through 2026. While the move helps the company avoid major operational slowdowns for now, the ...
IEEE

Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging

Abstract: Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the ...
Android

Google Fires Executives After Failing to Secure AI Memory Chips Amid Shortage

Google has reportedly dismissed several procurement executives after failing to secure essential high-bandwidth memory (HBM) for its AI hardware. Amid a global shortage, the company faced significant ...