Abstract: Embedded Multi-die Interconnect Bridge (EMIB) packaging technology has been being widely adopted in Intel's FPGA, Server CPU, GPU, and data centric high-performance compute (HPC) segments ...
L’impronta di packaging statunitense di Intel è un altro elemento distintivo. L’azienda gestisce strutture di packaging avanzate in Messico e Malesia e ha stabilito processi presso la struttura Amkor ...
Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...
Intel said that it's working with a Japanese DRAM company, Saimemory, to use available DRAM effectively by stacking it vertically.
That is the sort of detail that makes rumours sound “real” while still being completely free of consequences. There has been noise that Job’s Mob signed an NDA with Intel and pulled PDK samples for ...
Intel’s 18A is now shipping with gate-all-around and backside power delivery, marking a transition to commercial execution.
Intel is back in focus as Apple reportedly looks to use its U.S. foundries, sparking fresh debate over whether INTC stock is worth buying now.
NVIDIA is reportedly exploring options to diversify its chip supply chain, and Intel Foundry is an optimistic choice for next-gen AI lineups at the moment. NVIDIA Is Looking at a "Low Risk" ...
Intel (INTC) was in focus on Wednesday after the company's CFO disclosed a stock purchase, and tech giant Nvidia (NVDA) may use its foundry operations for some of its 2028 production. The news outlet ...
The semiconductor assembly and testing service industry is undergoing a structural transformation—and at the center of it is the United States. As traditional monolithic chip scaling runs into ...
Abstract: Co-packaged optics (CPO) and three-dimensional (3D) optoelectronics represent a new frontier in high-speed data communication, targeting the rising demands for bandwidth, energy efficiency, ...
Dopo aver completato lo sviluppo del chip AI5 destinato ai veicoli, Tesla si concentra su un altro fronte strategico: la ripartenza del progetto Dojo 3, terza generazione del supercomputer ...
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