Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...

L’impronta di packaging statunitense di Intel è un altro elemento distintivo. L’azienda gestisce strutture di packaging avanzate in Messico e Malesia e ha stabilito processi presso la struttura Amkor ...

NVIDIA is reportedly exploring options to diversify its chip supply chain, and Intel Foundry is an optimistic choice for next-gen AI lineups at the moment. NVIDIA Is Looking at a "Low Risk" ...

Intel said that it's working with a Japanese DRAM company, Saimemory, to use available DRAM effectively by stacking it vertically.

Intel’s 18A is now shipping with gate-all-around and backside power delivery, marking a transition to commercial execution.

That is the sort of detail that makes rumours sound “real” while still being completely free of consequences. There has been noise that Job’s Mob signed an NDA with Intel and pulled PDK samples for ...

ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage and 2x-3x density advantage over HBM, is the product of a jv between Softbank, Tokyo University and Intel called Saimemory ...

MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it plans to double investment in data center-related technologies, including advanced packaging and high-speed ...

The company appears to have hit a wall on transistor scaling, so it is eyeing advanced packaging as if it were the last open bar in Loughborough. China’s biggest chip manufacturer is looking to the ...

Intel could be close to a major foundry win.

Apple is exploring Intel for entry-level M-series chips, reflecting political pressure, cost concerns, and risk diversification rather than dissatisfaction with TSMC. For TSMC, these "non-core" ...

Intel (INTC) was in focus on Wednesday after the company's CFO disclosed a stock purchase, and tech giant Nvidia (NVDA) may use its foundry operations for some of its 2028 production. The news outlet ...