ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage and 2x-3x density advantage over HBM, is the product of a jv between Softbank, Tokyo University and Intel called Saimemory ...
Abstract: Embedded Multi-die Interconnect Bridge (EMIB) packaging technology has been being widely adopted in Intel's FPGA, Server CPU, GPU, and data centric high-performance compute (HPC) segments ...
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