Stacking dies will dramatically improve performance, but it’s still a work in progress.

SNPS expands its TSMC partnership, advancing AI, SoC, and multi-die design with certified flows, IP, and 3DIC innovations.

TI’s MSPM0 MCUs help simplify the process of determining the best scalable microcontroller family, pinpointing the right MCU ...

Package your Python applications for redistribution with one click, no compiling, and almost no additional software.

Under Dan Lanning, Oregon has quietly become a top quarterback finishing school from Bo Nix to Dillon Gabriel and now Dante Moore.

FuriosaAI founder and CEO June Paik said his startup’s architecture can reshape an industry dominated by Nvidia (NASDAQ: NVDA ...

Overview VS Code, CLion, and Qt Creator stand out for cross-platform flexibility and advanced features in 2025Code::Blocks and Dev-C++ remain reliable options f ...

The PassiveLogic–Aroundtown partnership represents a key milestone in Europe's pivot toward a low-carbon, high-performance ...

Tesla reported a surprise increase in sales as the electric car maker likely benefited from a rush to take advantage of a credit before it expired.

In a project that’s as much about curiosity as it is about innovation, a small team from EXO Labs has successfully run a ...

Six gigawatts over multiple generations, one gigawatt online in late 2026, a penny-a-share warrant, regulators and rivals ...

Traditional EDA tools rely on heuristics and static algorithms, which struggle to scale with modern design complexity. AI introduces a data-driven, adaptive approach, capable of learning from vast ...