Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Abstract: In today's high-frequency low-profile switching-mode power converters, paralleling winding in planar transformers is needed, especially for low voltage and high current applications.

FLIP: Benchmark tasks in fitness landscape inference for proteins Christian Dallago, Jody Mou, Kadina E Johnston, Bruce Wittmann, Nick Bhattacharya, Samuel Goldman, Ali Madani, Kevin K Yang NeurIPS ...

Ever notice how some words leap off the page while others seem to sink into the background like wallflowers at a dance? It's not magic. It's not even the words themselves. It's the fonts. Fonts are ...