Gradiant, a global leader in advanced water and wastewater solutions, today announced the successful completion of its work ...

The Kaynes Semicon expansion plan now coordinates with the existing clusters in Sanand (OSAT plant) and Dholera (emerging ...

This collaboration pairs specialist semiconductor and photonics venture capital with industrial validation to help founders ...

EDF played a crucial role in building a self-sustaining electronics ecosystem that encourages innovation, product design, and ...

Singapore's Meinhardt, which worked on phase one, will stay on to design phase two. Turner International is expected to ...

Tata Communications and TTBS unveil a unified AI platform for India's SMBs, but questions around pricing, liability, and ...

Hewlett Packard Enterprise (HPE) has outlined a strategy for AI-native networking and autonomous IT operations through an integrated platform combining assets from Aruba Networks and Juniper Networks.

Dell has expanded its premium consumer portfolio in India with new XPS, Dell, and Alienware laptops, betting on AI PCs, ...

As advanced packaging overtakes traditional packaging in value, pricing power is concentrating around AI, HBM, and a small ...

Tessolve has collaborated with Intel Foundry, supporting package design and completing a project end-to-end, which includes ...

Following the Chips Act 2.0, Berlin-based deeptech startup NextGO Epi receives 2 million euros for the production of the next ...

Samsung began mass-producing world's first 3nm process using GAA structure in 2022, and began mass production ...