The AI meeting could also include OpenAI's Sam Altman and Anthropic's Dario Amodei, spotlighting Korea's role in the global AI and semiconductor market. Samsung Electronics Executive Chairman Lee ...
As AI pushes more data through processors, accelerators, and embedded systems, CEA-Leti is rethinking the memory roadmap. The institute is not betting on a single emerging technology to replace SRAM, ...
The successful final review of EPI SGA2 highlights Menta's contributions in embedded programmability, design tool acceleration, and eFPGA architectures for next-generation high-performance computing.
The order builds on previous commercial agreements and development funding supported by the European Space Agency (ESA), strengthening EnSilica's position in a market expected to expand significantly ...
Strategic collaboration will soon give engineers direct access to BrainChip’s AKD1500 architecture through CELUS’s AI-guided design tools for device design LAGUNA HILLS, CA, UNITED STATES -- BrainChip ...
DDR5 memory was designed to address these needs by building on previous generations of DRAM with higher data rates, improved channel efficiency, enhanced power management, and greater module ...
NoC, and advanced Design-for-Test automation at the 63rd Design Automation Conference in Long Beach, California, from 27 to 29 July 2026. IDS-AI is an agentic AI framework that automates the chip ...
Precision Innovations is intended to join Siemens as a key addition to its industry-leading Digital Design Creation software, complementing existing digital design and implementation capabilities to ...
ELECTRA IC is at the forefront of the transition to post-quantum security, offering a robust portfolio of four specialized IP cores designed to meet the rigorous demands of “NIST-standard compliance” ...
Vietnam and Japan can strengthen cooperation in the semiconductor industry to meet both side’s demand, said Assoc. Prof. Dr Le Duc Anh of the University of Tokyo while mentioning Japan's semiconductor ...
(Nasdaq: AIP), a leading provider of semiconductor technology for accelerating innovation in the AI era, today announced it will release its financial results for the second quarter ended June 30, ...
A new SemiAnalysis teardown reveals that SMIC’s N+3 node, used in Huawei’s Kirin 9030, achieves a 32.5nm metal pitch—narrower than Intel’s 18A at 36nm. Despite lacking EUV lithography, SMIC leverages ...
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