Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...

South Koreas SK Hynix is accelerating its push into the artificial intelligence semiconductor market with a major new ...