SiC and GaN are reshaping automotive power electronics with greater efficiency, power density, and thermal performance.

Optimized for physical AI, AMD’s Ryzen AI Embedded X100 series processors combine CPU, GPU, and NPU resources on a single embedded SoC.

Advanced Energy’s AIH03ZPFC power factor correction (PFC) converter delivers 1100 W of output power in a half-brick form factor.

Based on Brainchip’s Akida neuromorphic engine, the AKD1500 edge AI coprocessor is now available in a compact M.2 form factor.

Advantech is launching a portfolio of servers based on AMD EPYC 9006 SP8 processors to support next-generation AI infrastructure.

Cadence says its AuraStack AI Super Agent is the industry's first agentic AI platform for PCB and advanced packaging design.

Creating a secure SDV ecosystem is a collaborative effort that involves engineers, security teams, and end users.

Yours truly can’t do the splits without ending up in the hospital, and it turns out the maneuver's equally difficult for USB.

USB-C will be 22 years old next month, from a published-specification standpoint. Yet it’s still rife with implementation ...

It took 100 years to come to fruition, but this recently created fluid enables non-magnetic electrostatic-based motors.

Siemens EDA has snapped up a San Diego startup to complement its digital design and implementation capabilities with ...

Tomocube’s HT-T1D is a desktop holotomography system for high-resolution 3D defect analysis of glass substrates in ...