Product Briefing Outline: ACI-ecotec GmbH & Co. KG has developed a new inline wafer separation system suitable for separating mono- and polycrystalline wafers in all common formats with thicknesses of ...
The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometres. “Infineon’s breakthrough in ultra-thin wafer ...
TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
IMEC and Vrije Universiteit Brussel (VUB) built and demonstrated an on-wafer liquid phase chromatograph using sub-micron micromachining at last week's IEEE International Electron Devices Meeting. The ...
Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these ...
Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...
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