LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...
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New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
The ADE tool applies the texture to only one side of the wafer, facilitating integration of the technology into a PERC process by providing surface decoupling without any additional ...
The fundamentals of a good Bosch etching system are described below; There are a number of significant features of the equipment used for Bosch processing which differ from normal ICP systems: In ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Etching is a method employed during the fabrication of semiconductors to chemically remove layers from the surface of the wafer substrate. Etching is a crucial process, and each wafer is subject to ...
OSAKA, Japan — Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the ...
Etching is a process that removes unwanted material from a wafer, which is also known as a "slice" or "substrate." Wafers are made of semiconducting material such as crystalline silicon and are used ...
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