“In response to market needs for more sophisticated integration processes for combining materials with different coefficients of thermal expansion, we have developed a revolutionary process technology ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...
SANTA CLARA, Calif., Sept. 08, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps ...
“Our 200-mm EVG850LT system has been instrumental in helping us fulfill customer requirements for high-performance SOI wafers,” stated Prof. He ZhiQiang, CEO of SST. “As we look to advance our ability ...
As we (TIRIAS Research) have written about previously, semiconductor supplier GlobalFoundries (GF) announced in early 2018 that the company was dropping its plans to develop a leading-edge 7nm process ...
AZoSensors on MSN
Miniaturized GC System Will Enable Rapid Food Quality Checks
Fraunhofer's innovative mobile gas chromatography system allows quick detection of volatile organic compounds, crucial for food safety and quality assurance.
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