SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

TAIPEI (Taiwan News) — Ennostar and Germany’s Allos Semiconductors announced Monday a partnership to mass produce 8-inch ...

OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

"Driven by AI accelerators, automotive ECUs, and edge computing, the global semiconductor silicon wafer market sees rising demand for 300mm, 200mm, and 100mm wafers, with advanced manufacturing ...