GRENOBLE, FRANCE: At the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, ...

A new member to ficonTEC's portfolio is the thermocompression die bonder BL500-M. High forces of up to 800 N in combination with a heating process and a split optic make it possible to bond large dies ...

Imec and Besi have developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a ...

VISTA, Calif. – Palomar Technologies, a manufacturer of automated assembly systems, has paired up two machines, the Gold Bumper and its flip-chip thermocompression bonder to create a gold bump attach ...