TSMC is developing an EMIB-like chip packaging to rival Intel’s EMIB, easing AI chip bottlenecks for Nvidia/AMD.

Record profits, but more worries.

TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a direct contest with Samsung Electronics, which entered the field earlier.

TSMC is speeding up its Arizona chip factories as AI demand surges, lifting planned US investment to $265 billion.

Taiwan Semiconductor Manufacturing (TSMC) plans to raise prices for both advanced and mature chip manufacturing services by as much as 10% in 2027, citing higher costs for materials, production ...

Both companies play important roles in the building boom from artificial intelligence.

Taiwanese chipmaker TSMC is raking in record profits during the AI boom—but it is also racing to help Taiwan develop wind power and other energy alternatives to fossil fuels amid a global energy ...

There is an old saying in the IT sector that probably dates back to the mainframe era that when it comes to electronic component and overall system prices, when demand exceeds supply you can milk the ...

TSMC's CEO dismissed concerns that it’s at a disadvantage to rivals already adopting ultra-expensive equipment to make cutting-edge chips. C.C. Wei said today that the chip giant has bought high-end ...

Taiwan Semiconductor Manufacturing isn’t falling behind in next-generation chip making, its CEO said, dismissing concerns that it’s at a disadvantage to rivals already adopting ultraexpensive ...