(Nanowerk Spotlight) Ink-jet printing of metal nanoparticles for conductive metal patterns has attracted great interest as an alternative to expensive fabrication techniques like vapor deposition. The ...

A centuries-old materials bonding process is being tested aboard the International Space Station in an experiment that could pave the way for more materials research of its kind aboard the orbiting ...

Japanese scientists are proposing a copper alternative to sintered silver die-attach and conductive ink. Sintering – the process of pressing powders together to form solids – can occur at far lower ...

Israeli 3D printing firm Nano Dimension has developed novel copper nano-particles that are resistant to oxidation, and fuse into conductive lines after sintering at <160°C. The main challenge in ...

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...