One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

SAN DIEGO--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...

Housed in QFN packages, the 24-bit MSC1201 and MSC1202 precision data acquisition chips integrate a low-noise delta-sigma A/D converter, an enhanced 8051 processor core, 4 or 8 Kbytes of flash memory, ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...

HILLSBORO, OR – APRIL 24, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of its low cost, low power MachXO2™ family of programmable logic ...

SCOTTSDALE, USA: Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. Put another way, package selection is increasingly important to ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Housed in a 3 x 3 mm QFN package with ESD protection on all pins, the RF2861 single-band, front-end receiver also integrates a TX LO buffer amplifier. Designed for CDMA, JCDMA and CDMA450 applications ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...