Imec has demonstrated the exceptional performance and flexibility of its 300mm RF silicon interposer platform. The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a ...
Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications LEUVEN (Belgium), MAY 27, 2025 — ...
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