The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Failure analysis is one of the best tools for any aerospace supplier or manufacturer. The scientific method-based approach to establishing cause and effect can be used across all phases of a product's ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

Amrutha Sampath is an accomplished electrical failure analysis engineer based in Austin, Texas. With a strong educational foundation, including a Master of Science in Electrical Engineering from Texas ...

Failure Mode, Mechanism and Effect Analysis (FMMEA) is a reliability analysis method which is used to study possible failure modes, failure mechanisms of each component, and to identify the effects of ...

Analyzing failures in printed circuit boards (PCBs) is critical to ensure the functionality and reliability of electronic devices. A synopsis of the methods and techniques utilized in PCB failure ...

Failure analysis (FA) is an important tool to evaluate the reliability of a product under actual operation. FA provides feedback to the product designers for improving design or even correct minor ...