Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...

Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s ...

Intel has showcased new chip packaging technologies, including a combination of Embedded Multi-die Interconnect Bridge (EMIB) and Foveros on a single chip and a new interconnect technology it dubs ...

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology ...

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...

Intel was the dominant semiconductor chip maker for decades. They were a generation or two ahead of all competitors. However, six years ago Intel started badly missing deadlines for new chips. Intel ...

Intel has showcased new chip packaging technologies, including a combination of Embedded Multi-die Interconnect Bridge (EMIB) and Foveros on a single chip and a new interconnect technology it dubs ...