Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...
Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...
Graduate students studying international business have the opportunity to travel to Asia and put their business skills to the ultimate test. The Executive Master of International Business program ...
Intel has showcased new chip packaging technologies, including a combination of Embedded Multi-die Interconnect Bridge (EMIB) and Foveros on a single chip and a new interconnect technology it dubs ...
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology ...
TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s ...
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...
Intel has released details on a new interconnect approach that it's using for future FPGAs, and could make available in CPUs as well, if demand is significant. Share on Facebook (opens in a new window ...
Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU, ...
Intel was the dominant semiconductor chip maker for decades. They were a generation or two ahead of all competitors. However, six years ago Intel started badly missing deadlines for new chips. Intel ...
Intel has showcased new chip packaging technologies, including a combination of Embedded Multi-die Interconnect Bridge (EMIB) and Foveros on a single chip and a new interconnect technology it dubs ...
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