A p-n junction is an interface or boundary between p-type and n-type semiconductor materials within a single semiconductor crystal. The positive (p) side contains excess holes, while the negative (n) ...

Silicon carbide (SiC) is a wide-bandgap semiconductor material utilized in high-power, high-temperature, and high-frequency electronic devices. 4H-SiC substrates have distinct characteristics, ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology SEMCO's collaboration with AMD focuses on meeting the unique challenges of ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore's Law beyond 2030, ensuring continuous development without being constrained by process size ...

Samsung Electro-Mechanics said that Executive Director Hwang Chi-won (head of the package development team) received a presidential citation at the 20th Electronics and IT Day awards ceremony held on ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...